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반도체 제조기술의 이해
- 저자
- 곽노열,배병욱,오경택,윤태균,이성희,임정훈,정용우,진수봉,최호승,홍기환 공저
- 출판사
- 한올출판사
- 출판일
- 2021-03-30
- 등록일
- 2021-07-22
- 파일포맷
- 파일크기
- 26MB
- 공급사
- YES24
- 지원기기
- PC PHONE TABLET 웹뷰어 프로그램 수동설치 뷰어프로그램 설치 안내
책소개
반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication, 반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들, 그리고 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대한다.
저자소개
목차
01 반도체 개요● 반도체 제조기술 개요···················································501. 반도체 정의····································································· 7● 반도체란?···································································7● 반도체의 종류 ····························································802. 반도체 역사···································································· 9● 트랜지스터 ·································································9● 메모리 ···································································· 12● 세계 메모리 반도체 선도하는 대한민국·························· 1503. 미래 메모리 반도체························································ 17● 메모리 시장······························································ 17● 기술적인 한계··························································· 18● PCRAM 제품·····························································20● ReRAM 제품 ····························································25● STT-MRAM 제품·······················································27● 요약········································································3102 DRAM Memory 제품01. DRAM Memory 소개·····················································37● DRAM이란? ·····························································37● DRAM 운용 제품별 특징·············································3902. DRAM 기본 동작 소개···················································· 41● MOSFET·································································· 41● DRAM Architecture ··················································45● 주요 동작 소개··························································48● SWD, S/A 동작 이해···················································52● REFRESH ·······························································5503. DRAM 주요 Process Module·········································57● ISO / GATE·······························································57● SAC·········································································59● SN·········································································· 61● MLM·······································································6204. DRAM 변화 방향···························································64● DRAM Memory 기술 변화 요구···································6403 NAND Memory 제품01. NAND FLASH Memory 소개··········································73● FLASH Memory란?···················································73● FLASH Memory Market Trend···································· 7602. NAND FLASH 기본 동작 소개·········································79● NAND Architecture···················································79● Erase/Read/Write Operation······································83● Cell의 형태 및 String 구조···········································93● ISPP········································································97● Cell 분포 및 Multi bit cell ···········································9903. 3D NAND 구조 소개···················································· 103● 2D NAND와 3D NAND············································103● PUC 구조·······························································106● CTF·······································································107● Pipe와 Pipeless ······················································ 110● 3D NAND Process Sequence····································11104. 3D NAND Key Process··············································· 115● PLUG···································································· 115● ONOP··································································· 119● SLIM····································································· 12105. Future NAND FLASH Memory···································· 123● 3D Re-NAND·························································123● 3D Fe-NAND·························································124● SGVC····································································12404 Diffusion_Furnace 공정01. Diffusion 소개···························································· 131● Diffusion 정의·························································132● Diffusion 대표 공정 및 소재 소개································133● Diffusion 대표 장비 소개···········································13702. Furnace공정 이해······················································· 142● Diffusion공정 소개··················································142● Oxidation공정 소개·················································142● LPCVD·································································· 149● ALD공정································································16003. Furnace 장비의 이해 ··················································· 170● Furnace 장비 소개··················································· 170● Batch 장비····························································· 171● Chamber 장비 소개················································· 17904. 공정과 장비 관리 소개·················································· 186● 전산 시스템 활용 관리··············································186● PM········································································18605. 미래 기술 해결 과제······················································18805 Diffusion (Ion Implant)01. Ion Implantation공정 개요··········································· 195● Ion Implantation공정의 역사와 정의··························· 195● Ion Implantation 관련 주요 공정································197● Ion Implantation공정의 주요 장비······························198● Ion Implantation 장비의 주요 구성·····························20002. DRAM/NAND Ion Implantation Application·················200● Well Formation·······················································201● Threshold Adjust Implant·········································202● Source/Drain Implant··············································202● Lightly Doped Drain················································20303. Ion Implantation 구성과 Hardware······························205● Gas 구성································································205● HW 기본 구성·························································20804. Ion Implantation Physics············································ 217● Scattering 현상······················································· 218● Stopping Mechanism··············································· 218● Ion Projection Range···············································221● Channeling Effect···················································222● Shadowing Effect···················································224● Damage Engineering···············································225● Annealing······························································227● RTA 도입 및 특징·····················································228● 이온주입 후의 Monitoring 방법··································23005. Ion Implantation 관련 미래 기술···································232● Cold & Hot Implantation··········································232● Plasma Doping·······················································233● Co Implantation······················································235● Advanced Anneal···················································237 06 Thinfilm_ CVD 공정01. CVD공정 소개 ····························································245● CVD공정 정의·························································24602. CVD공정의 역할 및 이해···············································248● 절연막 역할····························································248● Gap fill 특성····························································251● HARD MASK 역할···················································252● Low-k 절연막·························································25303. CVD 제조 Fab 장비의 이해············································254● 장비 관리 특성························································255● 주요 부품 특성의 이해··············································25704. CVD 주요 공정 장비의 소개···········································263● PE CVD USG공정····················································263● Thermal CVD BPSG공정··········································264● PE CVD ARC공정····················································266● HDP공정································································268● SOD공정································································271● PE Nitride공정························································273● ACL Hard Mask공정·················································273● Low-k공정·····························································275● NDC공정································································276● Gate ON Stack공정·················································27705. CVD 장비 향후 Trends·················································27807 Thinfilm_ PVD 공정01. PVD공정····································································285● PVD공정 소개·························································28502. PVD공정의 요구사항····················································28603. Metal 물질의 특성·······················································286● Aluminum 물질·······················································287● Titanium 물질·························································287● Tungsten 물질························································288● Cobalt 물질····························································289● Tantalum 물질························································289● Copper 물질···························································29004. PVD 주요 특성의 이해··················································290● Sheet Resistance····················································290● Contact Silicide 특성················································291● EM 현상·································································292● ALD 방식·······························································293● Damascene 구조·····················································29305. PVD공정의 Fab 장비의 이해········································· 294● Sputter공정 장비·····················································296● Contact Silicide·······················································300● ALD TiN 장비·························································302● CVD W 장비···························································304● LFW 장비·······························································307● EP Cu 장비·····························································309● Cu Barrier Metal 장비·············································· 31206. PVD공정 향후 Trends·················································· 31408 Photo 공정01. Photo공정의 역할························································321● Photo공정 소개·······················································321● Photo Process의 이해··············································322● Photo 장비의 종류···················································324● Photo에 사용되는 소재·············································32802. Photo공정·································································330● Imaging·································································330● Focus····································································336● Dose·····································································338● Leveling·································································339● Overlay··································································339● Alignment······························································ 341● Overlay··································································345● Overlay Control······················································348● MASK····································································353● Photo Resist···························································35703. Photo 장비·································································363● Track·····································································363● Scanner·································································37004. Photo공정 관리··························································377● Overlay··································································377● Incell·····································································379● CD········································································379● Defect···································································38105. Photo 미래 기술··························································382● 차세대 Photo Graphy 기술········································382● EUV란···································································386● 기존 ArF와의 차이점················································387● EUV 기술의 문제점··················································38809 Etch 공정01. Etch 소개···································································397● 실생활에서 본 Etch Engineering 개요 ························39702. Etch 기본···································································402● FAB공정과 반도체 소자············································402● Etch의 원리와 메커니즘············································408● 플라즈마 정의와 성질··············································· 413● Etch 고려사항························································· 419● Etch공정관리를 위한 결과물······································431● 식각 가스와 식각 물질 ·············································44003. Etch 적용과 응용·························································444● Etch 대표 구조공정··················································444● Etch 장비 구성과 종류··············································454● Plasma Source에 따른 Etch 장비 구분························46504. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476● 팹에서의 양산 기술·················································· 476● Etch 장비의 유지 관리··············································482● 양산에서 Etch가 가지는 어려움··································487● Etch 양산 엔지니어의 하루········································48905. Etch Issue 및 향후 개발 방향········································ 490● 반도체 미세화 트렌트와 식각 이슈······························490● 기술적 한계 극복 방안과 기술 발전 방향······················49210 Cleaning 공정01. Cleaning공정······························································507● Cleaning공정 소개···················································50702. Cleaning Chemical의 종류와 특징 ································ 511● SPM 세정······························································· 511● APM 세정······························································· 514● DHF / BOE 세정······················································ 517● H3PO4, Phosphoric Acid 세정····································520● Ozone 세정 ···························································521● NFAM 세정····························································525● Function Water 세정················································527● HF/NH3 Gas 건식 세정·············································53103. Cleaning 장비의 종류와 특징 ········································534● Batch Type····························································534● Wet Single Type·····················································537● Dry Single Type······················································539● Scrubber 세정························································54204. Cleaning공정의 품질 관리와 생산장비 관리····················544● defect ··································································544● Uniformity ····························································546● Contamination ·······················································548● Fume····································································548● Cross contamination···············································550● Selectivity······························································552● Leaning·································································553● Flow Rate······························································555● Temperature··························································557● Concentration ·······················································559● Exhaust ······························································· 561● Pressure ·······························································56305. Cleaning의 미래기술 ····················································56511 CMP 공정01. CMP공정 소개·····························································57302. CMP공정의 종류와 특징···············································578● Planarization··························································578● Isolation·································································58003. CMP 장비의 구성과 특징··············································582● Polisher·································································582● Cleaner··································································584● EPD······································································58704. CMP공정의 품질 관리와 생산 장비 관리·························· 591● Defect, Scratch·······················································591● Uniformity, APC······················································594● Slurry ···································································596● Selectivity······························································599● Dishing, Erosion······················································600● Pad ······································································602● Disk ······································································604● Membrane·····························································605● Retainer Ring ·························································609● Brush ··································································· 610● Filter ·····································································61105. CMP의 미래 기술 ························································ 61312 MI (Metrology & Inspection)01. Metrology ································································· 619● Metrology 개론······················································· 619● Device 박막 두께 측정·············································· 619● Device 구조/형태 측정·············································624● 박막 조성/물성 측정·················································629● 휨 측정··································································63602. Inspection·································································637● Inspection 개론·······················································637● BF/DF 검사·····························································638● 파티클 카운터························································· 641● 매크로 검사····························································643● 전자빔 검사····························································64303. 공정 계측 응용기술······················································646● 가상계측································································646● 측정 검사 기술 동향과 미래······································64713 반도체 용어해설반도체 용어해설·································································654
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